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| W55MID15 WINBOND MFIDWB TRANSPONDER Table of Contents1. 2. 3. 4. 5. GENERAL DESCRIPTION ......................................................................................................... 2 FEATURES ................................................................................................................................. 2 PAD DESCRIPTION ................................................................................................................... 3 BLOCK DIAGRAM ...................................................................................................................... 3 FUNCTIONAL DESCRIPTION.................................................................................................... 4 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 6. 6.1 6.2 7. 8. External Inductor Coupling Circuit ..................................................................................... 4 Voltage Regulator & System Power Supply ...................................................................... 4 Power-On Control Circuit................................................................................................... 4 Demodulation Control Circuit............................................................................................. 4 System Clock Generator.................................................................................................... 4 Bonding-ID Decoder .......................................................................................................... 4 Multiple Bonding-ID Arrays................................................................................................ 4 Data Format and Framing Generator ................................................................................ 4 Modulation Control Circuit ................................................................................................. 4 Absolute Maximum Ratings ............................................................................................... 5 DC Characteristics............................................................................................................. 5 ELECTRICAL CHARACTERISTICS ........................................................................................... 5 ORDERING INFORMATION....................................................................................................... 5 DESIGN INFORMATION ............................................................................................................ 6 8.1 8.1.1 Reference Design .............................................................................................................. 6 Demo Board....................................................................................................................... 6 9. 10. TIPICAL APPLICATION CIRCUIT .............................................................................................. 6 REVISION HISTORY .................................................................................................................. 7 -1- Publication Release Date: April 18, 2005 Revision A3 W55MID15 1. GENERAL DESCRIPTION MFIDWB (Magnetic Field Identification) is used in all areas of automatic data capture allowing contactless identification of objects using magnetic field. From ticketing to industrial automation and access control, the applications of MFID are burgeoning. In recent years automatic identification procedures have become very popular in many service industries, purchasing and distribution logistics, industry, manufacturing companies and material flow systems. W55MID15 is one of Winbond MFIDWB (Magnetic Field Identification) series in WinRFWB family that focus on toy and consumer related applications meanwhile W55MID15 provides manufacture bonding-ID transponder. Regarding the MFIDWB Reader series, the W55MID50 supports multifunctional MFIDWB Reader solution. Besides the single transponder application, W55MID35 offers multi-transponder recognition function for intelligent and smart toy applications. W55MID15 provides total 243 different bonding-IDs in manufacture and 10bit ID length in each ID. That can extremely save customer's design investment in consumer MFID related products. 2. FEATURES * Magnetic field resonance frequency: 13.56 MHz * Data clock: 32 KHz * Read-only bonding-ID transponder * Inductive coupled power supply for no battery operation * On-chip rectifier, voltage limiter, clock extraction * 10bit bonding-ID length * Provides Manchester coding data format * RS0, RS1, RS2, RS3, and RS4 the 3-state bonding finger for the total 243 bonding-ID option in manufacture * Low power, low voltage operation * Operating distance: 0 ~ 5cm * Operating temperature: 0 ~ 70 C * Package: Dice form * Reference design PC board Size: 1.0 x 1.0cm2 (with PCB antenna) * Winbond patented "3-state Bonding Finger" for multiple bonding-ID option * Minimize external component: capacitor and PCB antenna only -2- W55MID15 3. PAD DESCRIPTION SYMBOL PAD NO. I/O FUNCTIONAL DESCRIPTION NC RS4 RS3 RS2 RS1 RS0 VSS COIL0 COIL1 NC VDD 1 2 3 4 5 6 7 8 9 10 11 -I I I I I Ground I/O I/O -Power Testing only, no connection 3-state bonding finger 3-state bonding finger 3-state bonding finger 3-state bonding finger 3-state bonding finger Ground return path Coupling energy input and customer-ID output Coupling energy input and customer-ID output Testing only, no connection Power path 4. BLOCK DIAGRAM Voltage Regulator & System Power S l External Inductor Coupling Circuit Demodulation Control PowerOn Control Circuit System Clock Generato Bonding ID Decoder Multiple Bonding-ID Array Detuning Control Circuit Modulation Control Circuit Data Format & Framing Manchester Coding -3- Publication Release Date: April 18, 2005 Revision A3 W55MID15 5. FUNCTIONAL DESCRIPTION 5.1 External Inductor Coupling Circuit The external inductor coupling circuit is designed for 13.56MHz magnetic field resonance. The coupled center frequency will depend on equivalent inductor of external PCB inductor and a paralleled capacitor. 5.2 Voltage Regulator & System Power Supply The voltage regulator generates the need of device power supply. 5.3 Power-On Control Circuit System power-on control circuit initiates the device to get into initial state. 5.4 Demodulation Control Circuit The demodulation control circuit demodulates the signal of command, which is magnetic field coupling from W55MID50 MFIDWB Reader system. 5.5 System Clock Generator The system clock generator generates the need of device system clock. 5.6 Bonding-ID Decoder The memory array decoder circuit decodes the mapping location of memory array, which indicates by external RS0, RS1, RS2, RS3, and RS4 the 3-state Bonding Finger (Winbond patented). 5.7 Multiple Bonding-ID Arrays The multiple Bonding-IDs array provides total up to 243 different bonding-ID and 10bit in each ID. 5.8 Data Format and Framing Generator The data format and framing generator is in charge of the entire bonding-ID and command data into a Winbond defined MFIDWB tag format. 5.9 Modulation Control Circuit The modulation control circuit modulates the Winbond defined MFIDWB transponder format into the magnetic field resonation. -4- W55MID15 6. ELECTRICAL CHARACTERISTICS 6.1 Absolute Maximum Ratings PARAMETER RATING UNIT Maximum Current in COIL Power Dissipation (TA = 70C) Ambient Operating Temperature Storage Temperature 10 100 0 to +70 -40 to +85 mA mW C C Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. 6.2 DC Characteristics PARAMETER SYM. CONDITIONS Field in resonation Field in resonation Ambient operating temp (VDD -VSS = 4.5V, TA = 25C; unless otherwise specified) MIN. TYP. MAX. UNIT Operating Magnetic Field Operating Voltage Operating Temperature Operating Current Magnetic Resonat Voltage fOP VDD Tamb IOP VM 3 0 6 13.56 25 2 - 5.5 70 9 MHz V C A V fOP = 13.56 MHz 7. ORDERING INFORMATION W55MID15 provides two types of package in shipment: Dice form & Wafer PART NUMBER PACKAGE REMARKS W55MID15 W55MID15 Dice form Wafer form MOQ required -5- Publication Release Date: April 18, 2005 Revision A3 W55MID15 8. DESIGN INFORMATION 8.1 Reference Design This W55MID15 application schematic is subject to modify for target specification evaluation. Some components are due to system specification evaluation purpose only which will be removed once the system evaluation is done. The magnetic field coupling strength is subject to the appropriate value of inductor and capacitor. 8.1.1 Demo Board fop 13.56MH The value of "L" will depend on PCB coil layout and the value of "C" needs to fine-tune and matches the magnetic field resonance center fOP = 13.56 MHz 9. TIPICAL APPLICATION CIRCUIT W55MID15 RS RS RS RS RS VS COIL 1 2 3 4 5 6 7 8 x Y 1 9 VDD 1 COIL L C -6- W55MID15 10. REVISION HISTORY VERSION DATE PAGE DESCRIPTION A0 A1 A2 A3 Sep. 15, 2002 Dec. 29, 2002 May 14, 2003 April 18, 2005 7 Preliminary version Pin functional description update Application schematic update ADD IMPORTANT NOTICE Important Notice Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Further more, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. Headquarters No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/ Winbond Electronics Corporation America 2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441798 Winbond Electronics (Shanghai) Ltd. 27F, 2299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62365998 Taipei Office 9F, No.480, Rueiguang Rd., Neihu District, Taipei, 114, Taiwan, R.O.C. TEL: 886-2-8177-7168 FAX: 886-2-8751-3579 Winbond Electronics Corporation Japan 7F Daini-ueno BLDG, 3-7-18 Shinyokohama Kohoku-ku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800 Winbond Electronics (H.K.) Ltd. Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. -7- Publication Release Date: April 18, 2005 Revision A3 |
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